Introducing MNEMOSYNE: The New Standard in Space-Grade Non-Volatile Memory

We are excited to present MNEMOSYNE, the latest advancement in non-volatile memory technology from 3D PLUS. This memory solution is meticulously designed for the extreme conditions of space, offering unmatched reliability and performance for critical space missions.

Key Features of MNEMOSYNE

Radiation Tolerance:
MNEMOSYNE is built with high-density Spin Transfer Torque Magnetic RAM (STT-MRAM) technology and provides excellent radiation tolerance. It can withstand Total Ionizing Dose (TID) greater than 100 krad(Si) and Single Event Effects (SEE) with a Linear Energy Transfer (LET) threshold of more than 60 MeV.cm²/mg. This ensures that the memory remains reliable in the harsh radiation environment of space​ (3D Plus)​​ (3D Plus)​.

• Total Ionizing Dose (TID): > 100 krad(Si)
• Single Event Effects (SEE) LET threshold: > 60 MeV.cm²/mg
• Immune to Single Event Latch-up (SEL), Upset (SEU), Functional Interrupt (SEFI), and Transients (SET)
• High resilience in radiation environments

High Density and Endurance:
The memory modules are available in densities of 128 Mb, 512 Mb, and 1 Gb. MNEMOSYNE supports up to 100,000 program/erase cycles and guarantees data retention for over 20 years, making it an ideal choice for long-duration space missions​ (CORDIS)​​ (3D Plus)​.

• Densities: 128 Mb, 512 Mb, 1 Gb
• Endurance: Up to 100,000 program/erase cycles
• Data retention: 20 years
• Designed for long-duration space missions

Versatile Interface Options:
MNEMOSYNE supports both serial (SPI, DSPI, QSPI, OSPI) and parallel EEPROM interfaces, operating at voltages of 1.8V and 3.3V. This flexibility ensures compatibility with the latest FPGA and processor technologies used in space applications​ (3D Plus)​​ (3D Plus)​.

• Serial interfaces: SPI, DSPI, QSPI, OSPI
• Parallel interface: EEPROM
• Voltage supply: 1.8V and 3.3V
• Ensures compatibility with the latest FPGA and processor technologies

Operational Temperature Range:
MNEMOSYNE is designed to operate in temperatures ranging from -55 °C to +125 °C, ensuring functionality in a wide range of space environments​ (3D Plus)​.

• Operating temperatures: -55 °C to +125 °C
• Ensures functionality across a wide range of space environments

Project Background and Development

• Funded by: European Union’s Horizon 2020 program
• Project Goal: Develop a European-independent, radiation-hardened, high-density non-volatile memory for space
• Consortium Led by: 3D PLUS, including IMEC, Padova University, TRAD, NanoXplore, and Beyond Gravity
• Key Innovations:
  • First European space NVM RHBD (radiation hardened by design) with density > 1Mb and > 16MB
  • First next-generation spin transfer torque (STT) MRAM for space application
  • High-performance RHBD space NVM IP core on a sub-65nm process
  • RHBD applied on 22nm FDSOI for TID & SEE attenuation

Applications and Availability

MNEMOSYNE memory modules are perfectly suited for use as configuration solutions for the latest SRAM-based FPGAs and as boot/program code storage for advanced processors. These modules are designed to withstand the harsh thermal and mechanical environments of space, ensuring mission-critical reliability.

The first prototypes of MNEMOSYNE are scheduled to be available by Q2 2024, with full market release expected in Q4 2024​ (3D Plus)​.

For more information about MNEMOSYNE and to explore how it can benefit your space missions, visit our MNEMOSYNE information page or contact us directly.