Bi-Lobe® MIL-DTL-32139 QPL
Omnetics Nano-D connectors, at 0.25″ pitch, are some of the smallest ruggedized connectors on the market today. Compared to larger Micro-D and D-Subminiature configurations, Omnetics has reduczed size and weight by as much as 4x that of standard Micro-D connectors and 8x that of previous D-Sub footprints. Omnetics is a fully approved QPL manufacturer of MIL-DTL-32139.
Available with threaded mounting holes suitable for PCB and flex mounting. These connectors are available in standard sizes ranging from 9 through 65 positions, as well as custom configurations.
Electrical Mechanical Specifications
- Temperature: -55°C to 125°C (200°C with HTE)
- Durability: 200 Mating Cycles min*
- Insulator Resistance: 5000 Meg ohms min
- Voltage Rating (DWV): 250 VAC RMS Sea Level
- Shock: 100 g`s discontinuties > 10 nanosecond
- Vibration: 20 g`s discontinuties > 10 nanosecond
- Thermal Vacuum Outgassing: 1.0% max TML, 0.1% max VCM
- Contact Resistance: 71 mV Drop @ 1 Amp
- Current Rating: 1 Amp per contact
- Mating/Unmating Force: 7oz. (198g) max per contact
Material Specifications
- Shell Material and Finish:
Aluminum Shell, Electroless Nickel Plated
Aluminum Shell, Black Anodized
Aluminum Shell, Cadmium Plated
Titanium Shell, Unplated
Stainless Steel Shell, Passivated - Insulator: Liquid Crystal Polymer
- Pin: Gold Plated BeCu
- Insulator: LCP per MIL-DTL-83513 or PEEK
- Socket: Gold Plated Copper Alloy
- Encapsulant: Epoxy
MIL-DTL-32139
Omnetics Nano-D / Bi-Lobe® Catalogue
Omnetics Nano-D / Bi-Lobe® Ordering Guide
Omnetics Nano-D / Bi-Lobe® Dimensions
