COMBO [COnfiguration Memory BOot manage] (3DMCO0849)

Module Configuration

• Power Supply: 1.2V, 2.5V, 3.3V
• Temperature Range: -40°C to +105°C
• High level of miniaturization : 32 x 32 mm² area, 22 g

Interfaces
For user ground support to store bitstreams and configuration files:

• UART Interface:
• Baudrate: 115 200 bps
• SPI Ground Support interface:
• Bandwidth : up to 264 Mbps (Octal)

For in-flight use to boot SRAM FPGAs and MPSoCs:

• SPI Boot interface:
• Bandwidth : up to 264 Mbps (Dual Quad)
• SelectMap Interface
• Bandwidth : up to 264 Mbps (8 bits)

For in-flight use to Read and Write bitstreams/files

• SPI R&W interface:
• Bandwidth : up to 264 Mbps (Octal)

Radiation performances
 TID > 50 krad (Si)
 SEL LET > 62.5 MeV.cm²/mg

Description

The 3DCO0849 COMBO is a space grade configuration memory boot manager to configure SRAM based FPGAs requiring a large configuration memory.

More information

• Configuration Memory Boot Manager (Combo)

Downloads

• 3D Plus Memory Module P/N Decoder

Manufacturer Info

• www.3d-plus.com